18120916. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Sangjine Park of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18120916 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The provided patent application describes a substrate processing apparatus that includes a processing chamber with a processing space, a substrate support for holding a substrate in the chamber, an exhaust pipe located on the bottom wall of the chamber, an exhaust device for removing fluid from the processing space through the exhaust pipe, a first supply pipe with a portion inserted into the exhaust pipe and a portion outside the exhaust pipe, and a fluid supply device for delivering a fluid in a supercritical state to the processing space through the first supply pipe. The first inlet of the supply pipe and the exhaust opening of the exhaust pipe are both positioned on the central axis of the processing chamber.
- The substrate processing apparatus includes a processing chamber with a substrate support, exhaust pipe, and exhaust device.
- A first supply pipe is inserted into the exhaust pipe, allowing the delivery of a fluid in a supercritical state to the processing space.
- The first inlet of the supply pipe and the exhaust opening of the exhaust pipe are positioned on the central axis of the processing chamber.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used for various processes in semiconductor manufacturing, such as deposition, etching, and cleaning.
- Thin film coating: The apparatus can be utilized for applying thin films onto substrates, which is important in industries like optics, electronics, and solar cells.
- Surface modification: The technology can be employed for modifying the surface properties of substrates, enabling improved adhesion, wettability, or biocompatibility.
Problems solved by this technology:
- Efficient fluid delivery: The use of a supercritical fluid state allows for more effective and controlled delivery of fluids to the processing space.
- Enhanced substrate processing: The apparatus provides a stable and uniform environment for substrate processing, resulting in improved quality and yield.
- Reduced contamination: The exhaust device effectively removes fluid from the processing space, minimizing the risk of contamination.
Benefits of this technology:
- Improved process control: The use of a supercritical fluid state and precise fluid delivery enable better control over the substrate processing parameters.
- Higher productivity: The stable and uniform processing environment, along with efficient fluid delivery, can lead to increased productivity and reduced processing time.
- Cost savings: The technology offers the potential for reduced material waste, energy consumption, and maintenance costs.
Original Abstract Submitted
Provided is a substrate processing apparatus including a processing chamber including a processing space, a substrate support configured to support a substrate in the processing chamber, an exhaust pipe arranged on a bottom wall of the processing chamber, an exhaust device configured to exhaust a fluid in the processing space via the exhaust pipe, a first supply pipe including a first portion inserted into the exhaust pipe and a second portion outside the exhaust pipe, and a fluid supply device configured to supply a fluid in a supercritical state to the processing space via the first supply pipe, wherein a first inlet at an end portion of the first supply pipe and an exhaust opening at an end portion of the exhaust pipe are on a central axis of the processing chamber.
