20240087856.SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
Organization Name
Inventor(s)
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087856 titled 'SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
Simplified Explanation
The substrate treating apparatus described in the abstract is a system designed for plasma treatment of substrates. Here are some key points to note:
- Process chamber for plasma treatment
- Substrate support for holding the substrate
- Showerhead for supplying process gas
- Baffle surrounding the substrate support
- Substrate support acts as the first electrode
- Showerhead and baffle act as the second electrode
- Baffle has a variable height
- Area of the second electrode varies with the height of the baffle
Potential Applications
The technology can be used in various industries such as semiconductor manufacturing, electronics, and materials science for surface treatment of substrates.
Problems Solved
This technology solves the problem of uniform plasma treatment of substrates by controlling the height of the baffle to adjust the area of the second electrode.
Benefits
Some benefits of this technology include improved plasma treatment uniformity, increased efficiency, and better control over the process parameters.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices where precise plasma treatment is required for optimal performance.
Possible Prior Art
One possible prior art could be similar plasma treatment systems with fixed baffle designs that do not offer the flexibility of adjusting the electrode area.
Unanswered Questions
How does the variable height of the baffle impact the plasma treatment process?
The variable height of the baffle allows for control over the area of the second electrode, which in turn affects the distribution and intensity of the plasma treatment on the substrate.
What materials are commonly used for the construction of the baffle in such plasma treatment systems?
Common materials used for baffles in plasma treatment systems include stainless steel, aluminum, and ceramic materials that are compatible with the process gases and conditions inside the chamber.
Original Abstract Submitted
a substrate treating apparatus includes a process chamber configured to perform plasma treatment, a substrate support in a lower portion of the process chamber and configured to support a substrate, a showerhead in an upper portion of the process chamber and configured to supply a process gas for the plasma treatment toward the substrate, and a baffle surrounding the substrate support. the substrate support functions as a first electrode for generating plasma, the showerhead and the baffle function as a second electrode for generating the plasma, the baffle has a variable height, and an area of the second electrode varies as a height of the baffle varies.
