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Category:H01L23/498
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Pages in category "H01L23/498"
The following 200 pages are in this category, out of 619 total.
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- 18178816. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18183699. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18185248. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18188627. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18191212. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18195536. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18197998. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199553. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202375. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202735. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18204161. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18209286. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18212453. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212461. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18212939. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213386. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18213850. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18213967. TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18215212. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216632. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18217655. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18217725. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18218885. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18224948. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226534. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226866. QUANTUM DEVICE simplified abstract (NEC Corporation)
- 18227113. THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229039. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18229824. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18233863. MULTI-DIE PACKAGE ON PACKAGE simplified abstract (MediaTek Inc.)
- 18234092. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18235596. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18237209. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18241531. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18244350. INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18244462. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18244716. DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE simplified abstract (GOOGLE LLC)
- 18244739. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18252963. Integrated Electronic Component simplified abstract (Nippon Telegraph and Telephone Corporation)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18296056. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18298702. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18299795. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18299896. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18302884. PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18303380. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18306702. PACKAGED INTERCONNECT STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18308358. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18309070. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309113. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309149. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309250. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18312191. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18314287. SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18316482. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18317521. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18318827. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18319135. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18320456. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18320513. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18323646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18326554. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18329530. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18331973. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)
- 18340193. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18341345. SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18344927. SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18345955. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18346950. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18353279. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18355824. Architecture for Computing System Package simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18361482. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18366098. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18367039. METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
- 18367896. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368309. SEMICONDUCTOR PACKAGE INCLUDING ALIGNMENT MARKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18369684. INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18370914. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18371152. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18372846. SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18374396. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374996. EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380222. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380424. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)
- 18399189. NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (Intel Corporation)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18450836. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18455854. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18455922. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18459821. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18461569. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18462610. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18468362. PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18471875. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18475546. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18480310. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18480660. SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482944. MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18483211. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 18483884. CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18490995. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491551. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491637. FILTERING STRUCTURE AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18499964. SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FILLERS AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511641. PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 18513649. INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513866. SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18516579. SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTURE AND METHOD OF MAKING simplified abstract (Intel Corporation)
- 18516753. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18518456. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518790. CHIP PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519821. Antenna Apparatus and Fabrication Method simplified abstract (Infineon Technologies AG)
- 18520467. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521284. HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18523058. TERMINAL STRUCTURE AND ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18528856. ELECTRONIC APPARATUS simplified abstract (DENSO CORPORATION)
- 18538458. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18541878. SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract (Intel Corporation)
- 18543749. Techniques For Arranging Conductive Pads In Electronic Devices simplified abstract (Intel Corporation)
2
- 20240014087. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 20240021578. WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD simplified abstract (ZHEJIANG LAB)
- 20240030117. MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME simplified abstract (Qorvo US, Inc.)
- 20240047303. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240047336. ELECTRONIC PACKAGE simplified abstract (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 20240047421. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 20240055274. SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (PHOENIX PIONEER TECHNOLOGY CO., LTD.)
- 20240055310. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)
- 20240055334. TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
- 20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
- 20240087983.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240087998.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088003.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
- 20240088006.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
A
- Advanced micro devices, inc. (20240113004). CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET simplified abstract
- ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
- Apple inc. (20240105626). Semiconductor Package with Local Interconnect and Chiplet Integration simplified abstract
- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple Inc. patent applications on March 28th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 25th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 29th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Blockchain patent applications on March 7th, 2024
G
- Google llc (20240096859). Socket To Support High Performance Multi-die ASICs simplified abstract
- Google llc (20240105581). SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING simplified abstract
- GOOGLE LLC patent applications on February 15th, 2024
- Google LLC patent applications on March 21st, 2024
- GOOGLE LLC patent applications on March 28th, 2024
H
- Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
- Huawei Technologies Co., Ltd. patent applications on February 8th, 2024
- Hyundai motor company (20240105573). POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
- HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
- Hyundai Motor Company patent applications on April 18th, 2024
- HYUNDAI MOTOR COMPANY patent applications on March 14th, 2024
- Hyundai Motor Company patent applications on March 28th, 2024