18233863. MULTI-DIE PACKAGE ON PACKAGE simplified abstract (MediaTek Inc.)
Contents
- 1 MULTI-DIE PACKAGE ON PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-DIE PACKAGE ON PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MULTI-DIE PACKAGE ON PACKAGE
Organization Name
Inventor(s)
Tai-Hao Peng of Hsinchu City (TW)
Yao-Tsung Huang of Hsinchu City (TW)
MULTI-DIE PACKAGE ON PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18233863 titled 'MULTI-DIE PACKAGE ON PACKAGE
Simplified Explanation
The abstract describes a patent application for a multi-die package on package, consisting of a bottom package with two device dies and a top package with a memory die stacked on top.
- The innovation involves a multi-die package on package design.
- The bottom package contains a first device die and a second device die.
- Stacked on top of the bottom package is a top package with a memory die.
- This design allows for multiple dies to be stacked on top of each other, increasing functionality in a compact space.
Potential Applications
The technology could be applied in:
- Mobile devices
- Wearable technology
- Internet of Things (IoT) devices
Problems Solved
- Increased functionality in a compact space
- Efficient use of real estate on a circuit board
Benefits
- Higher performance capabilities
- Space-saving design
- Enhanced memory capacity
Potential Commercial Applications
- Consumer electronics
- Automotive industry
- Medical devices
Possible Prior Art
There may be prior art related to:
- Stacked die packaging
- Multi-chip modules
Unanswered Questions
How does this technology impact power consumption in devices?
The article does not address the potential impact of this technology on power consumption in devices.
Are there any limitations to the number of dies that can be stacked in this design?
The article does not mention any limitations on the number of dies that can be stacked in this design.
Original Abstract Submitted
A multi-die package on package includes a bottom package having a first device die and a second device die. A top package including a memory die is stacked on the bottom package.
