20240055274. SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (PHOENIX PIONEER TECHNOLOGY CO., LTD.)
SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Inventor(s)
Pao-Hung Chou of Hsinchu County (TW)
Ming-Yeh Chang of Hsinchu County (TW)
SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240055274 titled 'SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package carrier board structure described in the patent application includes multiple carrier board bodies and supporting bumps. Each carrier board body has a build-up circuit structure and conductive blocks attached to it. The conductive blocks of adjacent carrier board bodies are connected to each other, defining a cutting path. Openings are formed on the surface of each conductive block at the cutting path, with supporting bumps erected between the adjacent openings. These supporting bumps provide support during the semiconductor packaging operation and can be removed after singulation.
- The semiconductor package carrier board structure includes multiple carrier board bodies with conductive blocks.
- Adjacent carrier board bodies are connected through their conductive blocks, defining a cutting path.
- Openings are formed on the conductive blocks at the cutting path, with supporting bumps erected between them.
- Supporting bumps provide support during semiconductor packaging and can be removed after singulation.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Providing support during semiconductor packaging operation
- Facilitating singulation process
Benefits
- Improved efficiency in semiconductor packaging
- Simplified singulation process
- Enhanced structural integrity of semiconductor package carrier board
Original Abstract Submitted
a semiconductor package carrier board structure includes a plurality of carrier board bodies and a plurality of supporting bumps. the carrier board body includes a build-up circuit structure and a plurality of conductive blocks bonded to the build-up circuit structure. adjacent ones of the carrier board bodies are connected to each other with their corresponding conductive blocks. an area formed by the adjacent conductive blocks defines a cutting path. an opening is formed on a surface of each of the conductive blocks at the cutting path. the supporting bumps are erected between the adjacent openings. as such, each of the supporting bumps corresponds to a position overlapping the cutting path to provide the support function of the semiconductor package carrier board structure when performing the semiconductor packaging operation. after performing the singulation operation, the supporting bumps can be completely removed and one side of the openings can be exposed.
