18217725. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
KEUNYOUNG Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18217725 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with a pattern layer on one surface, consisting of pads and a plating wire between them. A protection layer covers the pattern layer, exposing the pads while physically separating at least one pad from the plating wire.
- The semiconductor package includes a substrate with a pattern layer on one surface
- The pattern layer consists of pads and a plating wire positioned between adjacent pads
- A protection layer covers the pattern layer, exposing the pads
- At least one pad is physically separated from the plating wire
Potential Applications
The technology described in this patent application could be applied in the manufacturing of semiconductor devices, integrated circuits, and electronic components where precise pad placement and protection are crucial.
Problems Solved
This technology solves the problem of potential short circuits or damage to the pads and plating wire in semiconductor packages due to physical contact or environmental factors.
Benefits
The benefits of this technology include improved reliability and durability of semiconductor packages, enhanced performance of electronic devices, and increased efficiency in manufacturing processes.
Potential Commercial Applications
- "Innovative Semiconductor Package Design for Enhanced Reliability and Performance"
Possible Prior Art
One possible prior art could be the use of protective layers in semiconductor packaging to prevent damage to sensitive components. However, the specific configuration of pads, plating wire, and physical separation as described in this patent application may be unique.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness and scalability?
The cost-effectiveness and scalability of this technology compared to existing solutions are not addressed in the patent application. Further research and analysis would be needed to determine these factors.
What impact could this technology have on the overall efficiency of semiconductor manufacturing processes?
The potential impact of this technology on the efficiency of semiconductor manufacturing processes is not discussed in the patent application. Understanding how this innovation could streamline production or improve yields would be valuable for assessing its practical implications.
Original Abstract Submitted
A semiconductor package includes a substrate. A pattern layer is disposed on a first surface of the substrate. The pattern layer includes a plurality of pads and a plating wire positioned between adjacent pads of the plurality of pads. A first protection layer is disposed on the first surface of the substrate to cover the pattern layer and expose the plurality of pads. At least one pad of the plurality of pads is physically separated from the plating wire.
