18468362. PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
Contents
- 1 PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE
Organization Name
Huawei Digital Power Technologies Co., Ltd.
Inventor(s)
PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18468362 titled 'PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE
Simplified Explanation
The packaging device described in the patent application includes two circuit substrates that are electrically connected, with different thermal conductivities in their insulation layers. This configuration allows for flexible layouts and targeted thermal management in electronic devices.
- The packaging device includes a first circuit substrate with a higher thermal conductivity insulation layer and a second circuit substrate with a lower thermal conductivity insulation layer.
- The first circuit substrate has a first electronic component, while the second circuit substrate has a second electronic component.
- The different thermal conductivities of the insulation layers allow for efficient heat dissipation and targeted thermal management in the electronic device.
Potential Applications
This technology can be applied in various electronic devices where thermal management is crucial, such as smartphones, laptops, and other portable electronic devices.
Problems Solved
This technology solves the problem of inefficient heat dissipation in electronic devices, which can lead to overheating and decreased performance.
Benefits
The targeted thermal management provided by this technology can improve the overall performance and reliability of electronic devices, extending their lifespan and enhancing user experience.
Potential Commercial Applications
This technology can be commercialized by electronic manufacturers looking to improve the thermal management of their devices, leading to more efficient and reliable products.
Possible Prior Art
One possible prior art could be the use of different materials with varying thermal conductivities in electronic packaging to improve heat dissipation. However, the specific configuration of two circuit substrates with different thermal conductivities in their insulation layers may be a novel approach.
Unanswered Questions
How does the cost of implementing this technology compare to traditional thermal management solutions?
The cost implications of using two circuit substrates with different thermal conductivities in electronic packaging are not addressed in the patent application. Further research and analysis would be needed to determine the cost-effectiveness of this approach.
What impact does the targeted thermal management have on the overall energy efficiency of the electronic device?
While the targeted thermal management provided by this technology can improve performance and reliability, its impact on the energy efficiency of the electronic device is not discussed. Additional studies would be required to evaluate the energy consumption implications of this innovation.
Original Abstract Submitted
A packaging device includes a first circuit substrate and a second circuit substrate that are electrically connected. The first circuit substrate includes a first line layer and a first insulation layer that are sequentially stacked, and a first electronic component is disposed on the first circuit substrate. The second circuit substrate includes a second line layer and a second insulation layer that are sequentially stacked, and a second electronic component is disposed on the second circuit substrate. A thermal conductivity of the first insulation layer is higher than a thermal conductivity of the second insulation layer. This application further provides a packaging module and an electronic device in which the packaging device is used. The packaging device in this application, the first insulation layer and the second insulation layer with different thermal conductivities are targetedly configured, and layouts of the first circuit substrate and the second circuit substrate are flexible.
