18471875. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Byeongchan Kim of Suwon-si (KR)
Hyunchul Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18471875 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a connection structure, a via protection layer, a first semiconductor chip, a through-silicon via (TSV), a second semiconductor chip, a conductive post, and a molding layer. The package is designed to electrically connect the first and second semiconductor chips while providing protection and structural support.
- Connection structure with via protection layer
- First semiconductor chip with TSV
- Second semiconductor chip stacked on the first chip
- Conductive post for electrical connection
- Molding layer for encapsulation and support
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other portable electronics. It could also be used in high-performance computing systems, data centers, and automotive electronics.
Problems Solved
1. Improved electrical connectivity between stacked semiconductor chips 2. Enhanced protection and support for delicate components 3. Efficient use of space in semiconductor packaging
Benefits
1. Increased performance and reliability of electronic devices 2. Reduction in size and weight of semiconductor packages 3. Cost-effective manufacturing process
Potential Commercial Applications
Optimizing Semiconductor Package Design for Enhanced Performance
Possible Prior Art
Prior art in semiconductor packaging includes techniques for stacking chips, using TSVs for electrical connections, and encapsulating components for protection. However, the specific combination of features described in this patent application may be novel and innovative.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
The cost-effectiveness of this technology compared to existing solutions is not explicitly addressed in the patent application. Further analysis and cost comparisons would be needed to evaluate this aspect.
What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing facilities?
The patent application does not discuss the potential challenges in large-scale implementation. Factors such as production scalability, material availability, and process compatibility could pose challenges that need to be addressed for widespread adoption of this technology.
Original Abstract Submitted
A semiconductor package includes a connection structure, a via protection layer on the connection structure, a first semiconductor chip on the via protection layer and including a first substrate having a first active face and a first inactive face opposite to each other a through-silicon via (TSV) configured to electrically connect the first semiconductor chip to the connection structure, and a second semiconductor chip on the first semiconductor chip and electrically connected to the first semiconductor chip. The second semiconductor chip includes a second substrate having a second active face and a second inactive face opposite to each other. The package includes a conductive post configured to electrically connect the second semiconductor chip and the connection structure with each other, and a molding layer filling a space between an upper surface of the connection structure and the second semiconductor chip, and the molding layer encloses the conductive post.
