Hyundai motor company (20240105573). POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105573 titled 'POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The power module for a vehicle described in the abstract includes a first substrate with a first metal circuit and a first spacer, a second substrate with a second metal circuit and a second spacer, and a semiconductor chip between the two substrates with the spacers extending towards each other.
- The power module includes two substrates with metal circuits and spacers, along with a semiconductor chip in between.
- The first substrate has a first metal circuit and spacer, while the second substrate has a second metal circuit and spacer.
- The semiconductor chip is positioned between the two substrates, with the spacers extending towards each other.
Potential Applications
The technology described in this patent application could be applied in electric vehicles, hybrid vehicles, and other automotive applications where power modules are required.
Problems Solved
This technology solves the problem of efficiently managing power distribution and heat dissipation in vehicle power modules, ensuring optimal performance and reliability.
Benefits
The benefits of this technology include improved power module efficiency, enhanced thermal management, and increased overall vehicle performance and reliability.
Potential Commercial Applications
The potential commercial applications of this technology could include automotive manufacturers, electric vehicle companies, and suppliers of power module components.
Possible Prior Art
One possible prior art for this technology could be existing power module designs used in electric vehicles or other automotive applications.
Unanswered Questions
How does this technology compare to traditional power module designs in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and traditional power module designs. Further research or testing may be needed to determine the specific advantages of this innovation.
What are the potential challenges in implementing this technology in mass-produced vehicles?
The article does not address the potential challenges in mass-producing vehicles with this technology. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations.
Original Abstract Submitted
a power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.
