18178816. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
Contents
SEMICONDUCTOR DEVICE
Organization Name
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Inventor(s)
Takahiro Nakagawa of Kawasaki Kanagawa (JP)
Kazuya Nishihori of Tokyo (JP)
Yasuhiko Kuriyama of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18178816 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a plurality of transistors coupled through serial coupling, with a first transistor, a second transistor, a third transistor, and a first diode arranged on a substrate. The second transistor consists of a first sub-transistor and a second sub-transistor coupled in parallel with each other, with the third transistor interposed between the first sub-transistor and the second sub-transistor in a first direction.
- Explanation of the patent/innovation:
- Semiconductor device with multiple transistors coupled through serial coupling - Second transistor composed of first and second sub-transistors in parallel - Third transistor interposed between first and second sub-transistors on substrate
- Potential applications of this technology:
- Advanced electronic devices - Power management systems - Integrated circuits
- Problems solved by this technology:
- Improved performance and efficiency of semiconductor devices - Enhanced functionality in electronic systems - Increased reliability and stability in circuit design
- Benefits of this technology:
- Higher integration density on a substrate - Enhanced signal processing capabilities - Reduced power consumption in electronic devices
- Potential commercial applications of this technology:
- Consumer electronics - Automotive electronics - Telecommunications equipment
- Possible prior art:
- Previous semiconductor devices with serially coupled transistors - Parallel sub-transistor configurations in electronic circuits
Questions:
1. How does the serial coupling of transistors in this semiconductor device improve performance compared to traditional designs? 2. What specific advantages does the interposition of the third transistor between the first and second sub-transistors provide in terms of functionality and efficiency?
Original Abstract Submitted
According to one embodiment, a semiconductor device includes a plurality of transistors. The transistors are coupled through serial coupling. The transistors include a first transistor and a second transistor. The semiconductor device further includes a third transistor and a first diode. The second transistor includes a first sub-transistor and a second sub-transistor that are coupled in parallel with each other. The first transistor, the first sub-transistor, the second sub-transistor, the third transistor, and the first diode are arranged on a substrate, with the third transistor interposed between the first sub-transistor and the second sub-transistor in a first direction.
