18302884. PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Beoungjun Choi of Suwon-si (KR)
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18302884 titled 'PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes a printed circuit board (PCB) with multiple conductive patterns and a photosensitive dielectric layer. The PCB has a first trench with a rough bottom surface between two conductive patterns, and the substrate body has a rough top surface between two other conductive patterns. The roughness of the bottom surface is greater than that of the top surface. The conductive patterns have different thicknesses, with the third pattern being thicker than the first two.
- The patent application describes a PCB with multiple conductive patterns and a photosensitive dielectric layer.
- The PCB has a first trench with a rough bottom surface and a rough top surface between different conductive patterns.
- The roughness of the bottom surface is greater than that of the top surface.
- The conductive patterns have different thicknesses, with the third pattern being thicker than the first two.
Potential Applications:
- Electronics manufacturing
- Circuit board design and production
- Consumer electronics
Problems Solved:
- Improved electrical conductivity and signal transmission
- Enhanced adhesion between conductive patterns and dielectric layer
- Reduction of signal interference and noise
Benefits:
- Higher performance and reliability of electronic devices
- Improved manufacturing efficiency and cost-effectiveness
- Enhanced functionality and miniaturization of electronic circuits
Original Abstract Submitted
A printed circuit board includes a substrate body, first, second, and third upper conductive patterns side by side in a first direction on a top surface of the substrate body, and a photosensitive dielectric layer that at least partially covers the top surface of the substrate body. A first trench is in the substrate body between the first and second upper conductive patterns. The first trench has a first surface roughness at a bottom surface thereof. The substrate body has a second surface roughness at the top surface thereof between the second and third upper conductive patterns. The first surface roughness is greater than the second surface roughness. Each of the first and second upper conductive patterns has a first thickness. The third upper conductive pattern has a second thickness greater than the first thickness.
