18314287. SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
Seokbong Park of Suwon-si (KR)
Junyoung Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18314287 titled 'SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with multiple regions stacked in different directions, semiconductor chips mounted on opposite sides of the regions, and molding members covering the chips.
- Substrate with stacked regions: The substrate has a first region, a second region in contact with the first region, and a third region connecting the first and second regions in a bent form.
- Semiconductor chips placement: A first semiconductor chip is mounted on one side of the first region, while a second semiconductor chip is mounted on one side of the second region.
- Molding members: A first molding member covers at least a portion of the first semiconductor chip on the first region, and a second molding member covers at least a portion of the second semiconductor chip on the second region.
Potential Applications
- Semiconductor packaging industry - Electronics manufacturing
Problems Solved
- Efficient stacking of semiconductor chips on a substrate - Protection of semiconductor chips with molding members
Benefits
- Compact design - Enhanced protection for semiconductor chips - Improved overall performance of semiconductor package
Original Abstract Submitted
A semiconductor package includes a substrate including a first region, a second region in contact with the first region with the first and second regions stacked in a first direction, and a third region extending from the first and second regions in a second direction, perpendicular to the first direction, to connect the first and second regions to each other in bent form, a first semiconductor chip on a first side opposite to a second side of the first region in contact with the second region, a second semiconductor chip on a first side opposite to a second side of the second region in contact with the first region, a first molding member on the first region and covering at least a portion of the first semiconductor chip, and a second molding member on the second region and covering at least a portion of the second semiconductor chip.
