18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE STRUCTURE
Organization Name
Inventor(s)
Kyung Don Mun of Suwon-si (KR)
Tae-Young Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18361099 titled 'SEMICONDUCTOR PACKAGE STRUCTURE
Simplified Explanation
The abstract describes a semiconductor package structure that includes a silicon substrate, multiple dies on the substrate, a mold layer between the dies, and a metal layer covering the upper side of the mold layer and part of the upper sides of each die. The structure also includes an opening that exposes the upper side of at least one die. A temperature controller is included to control the temperature of the dies, with a body defining a circulation region to circulate a fluid for temperature control and a passage part to allow fluid flow into or out of the circulation region. The fluid in the circulation region is in direct contact with the exposed upper sides of the dies.
- The semiconductor package structure includes a silicon substrate, multiple dies, a mold layer, and a metal layer.
- The metal layer covers the upper side of the mold layer and part of the upper sides of each die.
- An opening is present to expose the upper side of at least one die.
- A temperature controller is included to control the temperature of the dies.
- The temperature controller has a body with a circulation region for fluid circulation and a passage part for fluid flow.
- The fluid in the circulation region is in direct contact with the exposed upper sides of the dies.
Potential applications of this technology:
- Semiconductor packaging for electronic devices
- Integrated circuits and microprocessors
Problems solved by this technology:
- Efficient temperature control of multiple dies in a semiconductor package
- Prevention of overheating and damage to the dies
Benefits of this technology:
- Improved performance and reliability of semiconductor devices
- Enhanced thermal management capabilities
- Increased lifespan of electronic devices
Original Abstract Submitted
A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.
