18490172. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
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Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18490172 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, an interposer, semiconductor devices, first conductive connection members, and a molding member. The interposer has first bonding pads in individual mounting regions, and the semiconductor devices have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads, and the molding member covers the semiconductor devices and fills gaps between the interposer and the devices. One of the mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, where the first bonding pads are located.
- The semiconductor package includes a package substrate, interposer, semiconductor devices, conductive connection members, and a molding member.
- The interposer has bonding pads in individual mounting regions, and the semiconductor devices have chip pads connected to the bonding pads.
- Conductive connection members are present between the bonding pads and chip pads.
- The molding member covers the semiconductor devices and fills gaps between the interposer and devices.
- One of the mounting regions has a pad-free region with a cross shape and pad regions defined by it, where the bonding pads are located.
Potential Applications:
- This semiconductor package can be used in various electronic devices, such as smartphones, tablets, and computers.
- It can be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved:
- The semiconductor package provides a reliable and efficient way to connect semiconductor devices to the interposer and package substrate.
- It ensures proper electrical connections between the chip pads and bonding pads.
- The molding member helps protect the semiconductor devices from external elements and provides structural integrity to the package.
Benefits:
- Improved electrical connectivity and signal transmission between semiconductor devices and the package substrate.
- Enhanced protection and reliability of the semiconductor devices.
- Efficient use of space with the pad-free region and defined pad regions.
- Cost-effective manufacturing process for semiconductor packages.
Original Abstract Submitted
A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.
