18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 CIRCUIT TEST STRUCTURE AND METHOD OF USING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT TEST STRUCTURE AND METHOD OF USING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CIRCUIT TEST STRUCTURE AND METHOD OF USING
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ching-Fang Chen of Hsinchu (TW)
Chih-Hsien Lin of Hsinchu (TW)
CIRCUIT TEST STRUCTURE AND METHOD OF USING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517260 titled 'CIRCUIT TEST STRUCTURE AND METHOD OF USING
Simplified Explanation
The circuit test structure described in the patent application includes a chip with a conductive line tracing its perimeter, an interposer electrically connected to the chip, and a test structure connected to the conductive line. The test structure is configured to electrically connect a testing site to the conductive line.
- Chip with conductive line tracing perimeter
- Interposer electrically connected to chip
- Test structure connected to conductive line
- Testing site electrically connected to conductive line
Potential Applications
This technology could be applied in the semiconductor industry for testing and quality control purposes. It can also be used in the development of integrated circuits and electronic devices.
Problems Solved
1. Efficient testing of circuits 2. Improved quality control in semiconductor manufacturing
Benefits
1. Enhanced reliability of electronic devices 2. Streamlined testing processes 3. Increased efficiency in semiconductor manufacturing
Potential Commercial Applications
Optimizing testing procedures in semiconductor manufacturing for improved product quality and reliability.
Possible Prior Art
There may be prior art related to circuit test structures with conductive lines for testing purposes in the semiconductor industry.
Unanswered Questions
How does this technology compare to existing circuit test structures?
Answer: This article does not provide a direct comparison to existing circuit test structures in terms of performance, cost, or efficiency.
What are the specific technical specifications of the conductive line used in this circuit test structure?
Answer: The article does not delve into the specific technical specifications of the conductive line, such as material composition, width, or resistance.
Original Abstract Submitted
A circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. The circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. The circuit test structure further includes a test structure connected to the conductive line. The circuit test structure further includes a testing site, wherein the test structure is configured to electrically connect the testing site to the conductive line.
