18519821. Antenna Apparatus and Fabrication Method simplified abstract (Infineon Technologies AG)

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Antenna Apparatus and Fabrication Method

Organization Name

Infineon Technologies AG

Inventor(s)

Eung San Cho of Torrance CA (US)

Ashutosh Baheti of München (DE)

Saverio Trotta of München (DE)

Antenna Apparatus and Fabrication Method - A simplified explanation of the abstract

This abstract first appeared for US patent application 18519821 titled 'Antenna Apparatus and Fabrication Method

Simplified Explanation

The semiconductor device described in the abstract includes a semiconductor die with an RF circuit, a first dielectric layer, an antenna layer, and an antenna feeding structure. The antenna feeding structure is designed to couple the antenna layer to the RF circuit of the semiconductor die.

  • The semiconductor die has a via, and the antenna feeding structure includes a first portion within the opening of the semiconductor die and a second portion through the first dielectric layer.
  • The antenna feeding structure is crucial for connecting the antenna layer to the RF circuit of the semiconductor die, allowing for efficient communication and signal processing.
  • This technology enables the integration of antennas into semiconductor devices, improving their wireless communication capabilities and overall performance.
  • The design of the antenna feeding structure ensures a reliable and stable connection between the antenna layer and the RF circuit, enhancing the device's functionality.
  • Potential Applications:
 - Wireless communication devices
 - IoT devices
 - RFID systems
  • Problems Solved:
 - Efficient coupling of antennas to RF circuits
 - Integration of antennas into semiconductor devices
  • Benefits:
 - Improved wireless communication performance
 - Enhanced signal processing capabilities
 - Compact and integrated design
  • Potential Commercial Applications:
 - Mobile phones
 - Smart home devices
 - Wearable technology
  • Possible Prior Art:
 - Previous methods of coupling antennas to RF circuits in semiconductor devices
 - Antenna integration techniques in electronic devices
  1. Unanswered Questions
    1. How does the antenna feeding structure impact the overall size of the semiconductor device?

The size reduction of the semiconductor device due to the integration of the antenna feeding structure is not explicitly addressed in the abstract. Further details on the compactness and dimensions of the device would provide a clearer understanding of its physical characteristics.

    1. What specific RF frequencies can the semiconductor device operate at?

The abstract does not specify the RF frequencies at which the semiconductor device can operate. Knowing the range of frequencies supported by the device would be essential for determining its compatibility with different communication standards and applications.


Original Abstract Submitted

A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

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