18455854. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18455854 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with a cavity, a bridge chip structure in the cavity consisting of a first bridge chip and a second bridge chip stacked on top of each other, and multiple semiconductor chips placed laterally on the substrate. Each semiconductor chip has a first region electrically connected to the first bridge chip and a second region electrically connected to the second bridge chip.
- The semiconductor package includes a bridge chip structure with two stacked chips for improved performance.
- Multiple semiconductor chips are spaced apart laterally on the substrate for efficient use of space.
- Each semiconductor chip has regions connected to different bridge chips for optimized electrical connections.
- Potential Applications
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can also be applied in automotive electronics, industrial equipment, and communication devices.
- Problems Solved
- Provides a compact and efficient way to connect multiple semiconductor chips in a package.
- Optimizes electrical connections between semiconductor chips and bridge chips for improved performance.
- Benefits
- Improved performance and efficiency in electronic devices.
- Space-saving design for compact devices.
- Enhanced electrical connections for better functionality.
Original Abstract Submitted
A semiconductor package includes a substrate having a cavity, a bridge chip structure in the cavity of the substrate and including a first bridge chip and a second bridge chip stacked on the first bridge chip, and a plurality of semiconductor chips spaced apart laterally on the substrate. Each of the plurality of semiconductor chips includes a first region that is electrically connected to the first bridge chip and a second region that is electrically connected to the second bridge chip.
