20240088003.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngjun Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240088003 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a film substrate with wires, an insulating film, a semiconductor chip, and support patterns. The wires are covered by the insulating film, which has pad openings and a mounting region opening. The semiconductor chip is bonded to the exposed inner lead bonding portion of the wires. The support patterns on the lower surface of the film substrate overlap with the pad openings.
- Film substrate with wires and insulating film:
- Film substrate with wires on upper surface - Insulating film covering wires and defining pad openings
- Semiconductor chip bonding:
- Chip bonded to exposed inner lead bonding portion of wires
- Support patterns:
- On lower surface of film substrate - Overlapping with pad openings
Potential Applications
This technology could be used in various semiconductor packaging applications, such as in microprocessors, memory chips, and integrated circuits.
Problems Solved
This technology helps in improving the electrical connections and reliability of semiconductor packages by providing a secure bonding between the semiconductor chip and the wires on the film substrate.
Benefits
- Enhanced electrical connectivity - Improved reliability of semiconductor packages - Efficient heat dissipation
Potential Commercial Applications
"Semiconductor Package with Support Patterns for Improved Bonding" could find applications in industries such as electronics manufacturing, semiconductor packaging, and consumer electronics.
Possible Prior Art
One possible prior art could be the use of support patterns in semiconductor packages to improve bonding and reliability. Additionally, advancements in wire bonding techniques and insulating materials could also be considered as prior art in this field.
Unanswered Questions
How does the size of the support patterns impact the overall performance of the semiconductor package?
The article does not delve into the specific dimensions or design considerations of the support patterns and their effect on the functionality of the semiconductor package.
Are there any limitations to the materials used in the film substrate and insulating film that could affect the performance of the semiconductor package?
The article does not address any potential constraints or drawbacks related to the materials utilized in the film substrate and insulating film, which could be crucial factors in the overall performance and reliability of the semiconductor package.
Original Abstract Submitted
a semiconductor package includes a film substrate; a plurality of wires on an upper surface of the film substrate; an upper insulating film covering the plurality of wires on the upper surface of the film substrate and defining a plurality of pad openings and a mounting region opening such that, the plurality of pad openings expose at least a portion of an outer lead bonding portion of the plurality of wires along at least one of the first side surface or the second side surface and the mounting region opening exposes at least a portion of an inner lead bonding portion of the plurality of wiring; a semiconductor chip bonded to and electrically connected to the exposed inner lead bonding portion, and at least one support pattern on a lower surface of the film substrate and extending in the first direction to overlap with the plurality of pad openings.
