18516753. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tsung-Shu Lin of New Taipei City (TW)
Hsuan-Ning Shih of Taoyuan City (TW)
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516753 titled 'PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a package structure with a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure includes contact pads of different widths, with the conductive pads connected to them. The first contact pad is narrower than the conductive pads, while the second contact pad is equal to or wider than the conductive pads.
- Semiconductor die
- Redistribution circuit structure
- Conductive pads
- First contact pad narrower than conductive pads
- Second contact pad equal to or wider than conductive pads
Potential Applications
- Integrated circuits
- Electronic devices
- Semiconductor packaging
Problems Solved
- Efficient electrical connections
- Space-saving design
- Improved signal transmission
Benefits
- Enhanced performance
- Compact package structure
- Reliable electrical connections
Original Abstract Submitted
A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. The first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.
