18227113. THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
Organization Name
Inventor(s)
Jae Seung Choi of Suwon-si (KR)
Chang Seok Kwak of Suwon-si (KR)
Sang Joon Cheon of Suwon-si (KR)
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18227113 titled 'THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
Simplified Explanation
The abstract describes a three-dimensional semiconductor integrated circuit device with an inter-die interface. The device includes a top die with micro cells on the top surface, micro bumps on the bottom surface, and wiring patterns connecting the micro cells to the micro bumps. The bottom die has macro cells on its top surface, electrically connected to the micro bumps. The size of the region with micro cells is smaller than the region with micro bumps.
- Explanation of the patent/innovation:
- Three-dimensional semiconductor integrated circuit device - Top die with micro cells, micro bumps, and wiring patterns - Bottom die with macro cells connected to micro bumps - Size difference between region with micro cells and micro bumps
Potential Applications
The technology can be used in: - High-performance computing - Data centers - Artificial intelligence applications
Problems Solved
- Increased integration density - Improved performance and efficiency - Enhanced signal transmission speed
Benefits
- Higher processing power - Reduced footprint - Enhanced connectivity
Potential Commercial Applications
Optimized for: - Mobile devices - Internet of Things (IoT) devices - Automotive electronics
Possible Prior Art
- 3D integrated circuits - Inter-die connections - Semiconductor packaging technologies
Unanswered Questions
How does the device handle thermal management in a three-dimensional configuration?
The article does not address the specific methods or technologies used for thermal management in the three-dimensional semiconductor integrated circuit device.
What are the specific materials used in the construction of the micro cells and micro bumps?
The article does not provide details on the materials used for the micro cells and micro bumps in the device.
Original Abstract Submitted
A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
