18215212. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Mina Choi of Suwon-si (KR)

Heejung Hwang of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18215212 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a package structure with multiple semiconductor chips, redistribution structures, encapsulants, and through-vias.

• The package structure includes a first redistribution structure with at least one semiconductor chip, covered by an encapsulant, and a through-via passing through the encapsulant.
• A second package structure is placed on top of the first package structure, with its own redistribution structure, semiconductor chip, encapsulant, and through-via.
• The through-vias from both package structures are positioned between non-active surfaces.

Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor packages for various electronic devices.

Problems Solved

This innovation helps in improving the integration and connectivity of multiple semiconductor chips within a compact package structure.

Benefits

The technology allows for efficient stacking of semiconductor chips, enhancing performance and functionality in electronic devices.

Potential Commercial Applications

"Advanced Semiconductor Package Structure for Enhanced Connectivity and Integration"

Possible Prior Art

There may be existing patents or publications related to semiconductor package structures with through-vias for improved connectivity.

How does this technology impact the overall size of electronic devices?

This technology could potentially reduce the overall size of electronic devices by enabling the stacking of multiple semiconductor chips in a compact package structure.

What are the implications of using through-vias in semiconductor packaging?

The use of through-vias can improve signal transmission, reduce signal interference, and enhance the overall performance of electronic devices.

Original Abstract Submitted

A first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-via passing through the first encapsulant; a second package structure including a second redistribution structure, at least one second semiconductor chip disposed on the second redistribution structure, a second encapsulant covering the at least one second semiconductor chip, and a second through-via passing through the second encapsulant. The second package structure is disposed on the first package structure. At least one of a first upper end of the first through-via or a second upper end of the second through-via is between a first non-active surface and a second non-active surface.