18361482. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Moon Gil Jung of Suwon-si (KR)
Kwang-Bae Kim of Suwon-si (KR)
Hyung Jun Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18361482 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution substrate with redistribution patterns, a semiconductor chip, metal pillars, and solder balls.
- The redistribution substrate has a first side and a second side, with the semiconductor chip placed on the first side.
- Metal pillars are positioned around the periphery of the semiconductor chip and connected to the redistribution patterns.
- Solder balls are located on the second side of the redistribution substrate.
- Each metal pillar has a square or octagonal shape in plan view.
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- Potential Applications
- Advanced semiconductor packaging technology
- High-performance electronic devices
- Problems Solved
- Improved electrical connections between semiconductor chip and substrate
- Enhanced thermal management in semiconductor packages
- Benefits
- Higher reliability and performance of electronic devices
- Increased efficiency in heat dissipation
- Miniaturization of electronic components
Original Abstract Submitted
A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.
