20240055334. TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
Organization Name
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor(s)
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240055334 titled 'TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
Simplified Explanation
The patent application describes an electronic device assembly with a circuit containing at least one semiconductor die and a signal lead with a hole. An electrically conductive signal pin holder is placed in the hole and connected to the signal lead. The assembly is encapsulated in a molding compound, with the open end of the signal pin holder accessible outside the compound.
- The electronic device assembly includes a circuit with at least one semiconductor die.
- A signal lead with a hole is electrically coupled to the circuit.
- An electrically conductive signal pin holder is placed in the hole of the signal lead and connected to it.
- The assembly is encapsulated in a molding compound, with the open end of the signal pin holder accessible outside the compound.
Potential Applications
- Electronics manufacturing
- Semiconductor packaging
Problems Solved
- Secure electrical connection between the circuit and signal lead
- Protection of the circuit and signal lead from external elements
Benefits
- Improved reliability of electronic devices
- Enhanced durability and protection of internal components
Original Abstract Submitted
in a general aspect, an electronic device assembly includes a circuit including at least one semiconductor die, and a signal lead electrically coupled with the circuit. the signal lead has a hole defined therethrough. the assembly further includes an electrically conductive signal pin holder disposed in the hole of the signal lead. the electrically conductive signal pin holder is electrically coupled with the signal lead. the assembly also includes a molding compound encapsulating, at least, the circuit; a portion of the signal lead including the hole; and a portion of the electrically conductive signal pin holder. an open end of the electrically conductive signal pin holder is accessible outside the molding compound.
