18482743. PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Jen-Yuan Chang of Hsinchu City (TW)

Sheng-Chih Wang of Hsinchu City (TW)

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18482743 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

Simplified Explanation

The abstract describes a package structure that includes a package substrate, two dies, and two underfills. The first die and second die are placed on the package substrate. The first underfill is located between the first die and the package substrate, and it has an extension portion that extends from a sidewall of the first die towards the second die. The second underfill is located between the second die and the package substrate, and it has an extension portion that extends from a sidewall of the second die towards the first die, overlapping the first extension portion on the package substrate.

  • The package structure includes a package substrate, two dies, and two underfills.
  • The first die and second die are positioned on the package substrate.
  • The first underfill is located between the first die and the package substrate.
  • The first underfill has a portion that extends from a sidewall of the first die towards the second die.
  • The second underfill is located between the second die and the package substrate.
  • The second underfill has a portion that extends from a sidewall of the second die towards the first die.
  • The second extension portion of the second underfill overlaps the first extension portion of the first underfill on the package substrate.

Potential applications of this technology:

  • Semiconductor packaging
  • Electronics manufacturing

Problems solved by this technology:

  • Improved thermal management in semiconductor packages
  • Enhanced mechanical stability and reliability of the package structure

Benefits of this technology:

  • Efficient heat dissipation
  • Reduced risk of package failure due to mechanical stress
  • Improved overall performance and lifespan of electronic devices


Original Abstract Submitted

A package structure includes a package substrate, a first die, a second die, a first underfill, and a second underfill. The first die and a second die are disposed on the package substrate. The first underfill is between the first die and the package substrate, and the first underfill includes a first extension portion extending from a first sidewall of the first die toward the second die. The second underfill is between the second die and the package substrate, and the second underfill includes a second extension portion extending from a second sidewall of the second die toward the first die, the second extension portion overlapping the first extension portion on the package substrate.

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