18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368760 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a complex arrangement of redistribution wiring layers, semiconductor chips, and a heat transfer medium. Here is a simplified explanation of the patent application:
- The semiconductor package consists of multiple redistribution wiring layers, with semiconductor chips arranged on different regions of these layers.
- A heat transfer medium is placed on top of one of the redistribution wiring layers, overlapping with a semiconductor chip, to facilitate heat dissipation.
- The arrangement allows for efficient cooling of the semiconductor chips while optimizing space utilization within the package.
Potential Applications
The technology described in this patent application could be applied in various electronic devices where multiple semiconductor chips need to be densely packed while ensuring effective heat dissipation. This includes applications in mobile devices, computers, servers, and other electronic systems.
Problems Solved
This technology addresses the challenge of managing heat dissipation in densely packed semiconductor packages. By strategically placing semiconductor chips and a heat transfer medium within the package, it helps prevent overheating and ensures optimal performance of the electronic devices.
Benefits
The benefits of this technology include improved thermal management, increased reliability of electronic devices, and enhanced overall performance. By efficiently dissipating heat generated by the semiconductor chips, the technology can extend the lifespan of the devices and enhance their functionality.
Potential Commercial Applications
The technology described in this patent application has potential commercial applications in the semiconductor industry, particularly in the development of advanced packaging solutions for electronic devices. Companies involved in the manufacturing of mobile devices, computers, servers, and other electronic systems could benefit from implementing this technology to improve the thermal performance of their products.
Possible Prior Art
One possible prior art for this technology could be the use of heat sinks or thermal pads in semiconductor packages to facilitate heat dissipation. However, the specific arrangement of redistribution wiring layers, semiconductor chips, and heat transfer medium as described in this patent application may represent a novel approach to thermal management in semiconductor packaging.
Unanswered Questions
How does the heat transfer medium interact with the semiconductor chips to dissipate heat effectively?
The abstract mentions the use of a heat transfer medium overlapping with a semiconductor chip, but the specific mechanism of heat dissipation is not detailed. Further information on the thermal conductivity and interface properties of the heat transfer medium would help clarify this aspect.
What are the specific design considerations for optimizing the arrangement of semiconductor chips within the package?
While the abstract mentions the spacing and arrangement of semiconductor chips on different regions of the redistribution wiring layers, more details on the design considerations for achieving optimal performance and heat dissipation would provide valuable insights for engineers and designers working on similar semiconductor packages.
Original Abstract Submitted
A semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.
