18252963. Integrated Electronic Component simplified abstract (Nippon Telegraph and Telephone Corporation)

Integrated Electronic Component

Organization Name

Nippon Telegraph and Telephone Corporation

Inventor(s)

Tadashi Minotani of Musashino-shi, Tokyo (JP)

Integrated Electronic Component - A simplified explanation of the abstract

This abstract first appeared for US patent application 18252963 titled 'Integrated Electronic Component

Simplified Explanation

The abstract describes an integrated electronic component that consists of a lower chip, a molded resin, a rewiring layer, and an upper chip. The rewiring layer includes electrode pads on the lower surface of an insulator, electrode pads on the upper surface of the insulator, and interlayer connection conductors within the insulator to connect the electrode pads.

• The integrated electronic component includes a lower chip, a molded resin, a rewiring layer, and an upper chip.
• The rewiring layer consists of electrode pads on the lower surface of an insulator, electrode pads on the upper surface of the insulator, and interlayer connection conductors within the insulator.
• The electrode pads on the lower surface of the insulator are connected to the electrode pads on the upper chip, and the electrode pads on the upper surface of the insulator are connected to the electrode pads on the lower chip.
• The electrode pads and the electrode pads are positioned facing each other.

Potential applications of this technology:

• Integrated electronic components can be used in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
• This technology can be applied in the automotive industry for advanced driver assistance systems, infotainment systems, and other electronic components.
• It can be utilized in medical devices, aerospace applications, and industrial automation systems.

Problems solved by this technology:

• The integrated electronic component provides a compact and efficient solution for connecting electrode pads between chips.
• It eliminates the need for complex and bulky wiring connections, reducing the overall size and weight of electronic devices.
• The interlayer connection conductors within the insulator improve the reliability and performance of the component.

Benefits of this technology:

• The integrated electronic component offers improved connectivity and signal transmission between chips.
• It enables higher integration density, allowing for more functionality in smaller devices.
• The compact design and efficient wiring reduce manufacturing costs and improve overall system performance.

Original Abstract Submitted

An integrated electronic component includes a lower chip having electrode pads, a molded resin, a rewiring layer, and an upper chip having electrode pads. The rewiring layer has electrode pads that are formed on the lower surface of an insulator and are connected to the electrode pads, electrode pads that are formed on the upper surface of the insulator and are connected to the electrode pads, and interlayer connection conductors that are formed in the insulator and connect the electrode pads and the electrode pads. The electrode pads and the electrode pads are disposed to face each other.