18185248. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18185248 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a signal transfer path between semiconductor chips. It consists of a first redistribution substrate, a semiconductor chip stack with a lower chip and an upper chip, a through post arranged around the chip stack, and a second redistribution substrate on top of the chip stack and through post. The upper chip has a through-electrode on an integrated circuit layer and has a front surface facing the lower chip and a back surface facing the second redistribution substrate.
- The semiconductor package includes a signal transfer path between semiconductor chips.
- It consists of a first redistribution substrate, a chip stack with a lower and upper chip, a through post, and a second redistribution substrate.
- The upper chip has a through-electrode on an integrated circuit layer.
- The front surface of the upper chip is the active face facing the lower chip.
- The back surface of the upper chip is the inactive face facing the second redistribution substrate.
Potential applications of this technology:
- Semiconductor packages with improved signal transfer paths.
- Enhanced performance and connectivity between semiconductor chips.
Problems solved by this technology:
- Improved signal transfer between semiconductor chips.
- Enhanced integration and stacking of chips in a package.
Benefits of this technology:
- Increased performance and efficiency of semiconductor packages.
- Improved connectivity and communication between chips.
- Enhanced integration and miniaturization of semiconductor devices.
Original Abstract Submitted
A semiconductor package having a signal transfer path between semiconductor chips and a method of manufacturing the semiconductor package are provided. The semiconductor package includes a first redistribution substrate, a semiconductor chip stack arranged on the first redistribution substrate and including a lower chip and an upper chip, a through post arranged on the first redistribution substrate around the semiconductor chip stack, and a second redistribution substrate arranged on the semiconductor chip stack and the through post. The upper chip includes a through-electrode arranged on an integrated circuit layer, and has a front surface, which is an active face and faces the lower chip, and a back surface, which is an inactive face and faces the second redistribution substrate.
