18521284. HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Mirng-Ji Lii of Sinpu Township (TW)
Chen-Shien Chen of Zhubei City (TW)
Lung-Kai Mao of Kaohsiung City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Wen-Hsiung Lu of Tainan City (TW)
HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521284 titled 'HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME
Simplified Explanation
The method described in the patent application involves the formation of a package component by creating openings in a dielectric layer, depositing metallic materials, planarizing the materials to form metal pads, and selectively depositing a second metallic material to form bond pads. The package component is then bonded to another package component.
- Explanation of the patent:
- Form a package component with metal and bond pads - Bond the package component to another component
Potential Applications
The technology described in the patent application could be used in the manufacturing of electronic devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This technology solves the problem of efficiently and effectively creating bond pads on package components, which are essential for connecting different components in electronic devices.
Benefits
- Improved connectivity in electronic devices - Enhanced reliability of bond pads - Streamlined manufacturing process
Potential Commercial Applications
Title: Electronic Device Manufacturing Applications The technology could be applied in the production of various electronic devices, leading to more reliable and efficient products in industries such as telecommunications, consumer electronics, and automotive.
Possible Prior Art
There may be prior art related to methods of forming bond pads on package components in the field of semiconductor manufacturing. One example could be techniques for depositing and planarizing metallic materials in electronic devices.
Unanswered Questions
How does this technology compare to existing methods of forming bond pads on package components?
This article does not provide a direct comparison with existing methods, so it is unclear how this technology differs or improves upon current practices.
What are the specific materials used in the formation of the bond pads, and how do they contribute to the overall performance of the package component?
The article does not delve into the specific materials used or their impact on the performance of the package component, leaving this aspect unanswered.
Original Abstract Submitted
A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.
