PACKAGE STRUCTURE

The abstract describes a package structure for an electronic device, which includes a semiconductor die, a redistribution circuit structure, and an insulating encapsulation. The redistribution circuit structure consists of a colored dielectric layer, inter-dielectric layers, and redistribution conductive layers embedded within the inter-dielectric layers. The electronic device is connected to the redistribution circuit structure.

The package structure includes a semiconductor die, an insulating encapsulation, and a redistribution circuit structure.
The redistribution circuit structure comprises a colored dielectric layer, inter-dielectric layers, and redistribution conductive layers.
The electronic device is connected to the redistribution circuit structure.

Potential Applications

This technology could be applied in:

Consumer electronics
Automotive electronics
Medical devices

Problems Solved

This technology helps in:

Enhancing the reliability of electronic devices
Improving the performance of semiconductor dies
Providing better protection for the semiconductor die

Benefits

The benefits of this technology include:

Increased durability of electronic devices
Enhanced electrical connectivity
Improved overall functionality of the electronic device

Potential Commercial Applications

The potential commercial applications of this technology could be in:

Semiconductor manufacturing companies
Electronics assembly companies
Research and development organizations

Possible Prior Art

One possible prior art could be the use of redistribution layers in semiconductor packaging to improve electrical connectivity and performance.

Unanswered Questions

How does the colored dielectric layer impact the overall performance of the electronic device?

The colored dielectric layer may have specific properties that could affect the functionality of the device, but this aspect is not elaborated on in the abstract.

What specific materials are used in the inter-dielectric layers?

The abstract mentions inter-dielectric layers, but the materials used in these layers are not specified.

Original Abstract Submitted

A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Contents

PACKAGE STRUCTURE

Organization Name

Inventor(s)