18306702. PACKAGED INTERCONNECT STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

PACKAGED INTERCONNECT STRUCTURES

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Kai-Fung Chang of Taipei City (TW)

Chin-Wei Liang of Zhubei City (TW)

Sheng-Feng Weng of Taichung City (TW)

Ming-Yu Yen of Miaoli County (TW)

Cheyu Liu of Hsinchu County (TW)

Hung-Chih Chen of Hsinchu City (TW)

Yi-Yang Lei of Taichung City (TW)

Ching-Hua Hsieh of Hsinchu (TW)

PACKAGED INTERCONNECT STRUCTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18306702 titled 'PACKAGED INTERCONNECT STRUCTURES

Simplified Explanation

The abstract describes a method of manufacturing semiconductor devices by pre-manufacturing interconnect structure packages and placing them onto a carrier substrate along with a semiconductor die package. A molding compound layer is then formed around and in between the interconnect structure packages and the semiconductor die package.

• Interconnect structure packages (e.g., TSV packages, TIV packages) are pre-manufactured.
• Interconnect structure packages are placed onto a carrier substrate during semiconductor device package manufacturing.
• Semiconductor die package is placed on the carrier substrate adjacent to the interconnect structure packages.
• A molding compound layer is formed around and in between the interconnect structure packages and the semiconductor die package.

Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor devices, such as high-performance microprocessors, memory chips, and other integrated circuits.

Problems Solved

This technology streamlines the manufacturing process of semiconductor devices by pre-manufacturing interconnect structure packages, reducing the complexity and time required for backend packaging.

Benefits

- Improved efficiency in semiconductor device manufacturing - Enhanced reliability of interconnect structures - Cost savings in production processes

Potential Commercial Applications

"Advanced Manufacturing Process for Semiconductor Devices"

Possible Prior Art

There may be prior art related to the use of pre-manufactured interconnect structure packages in semiconductor device packaging processes.

Unanswered Questions

How does the pre-manufacturing of interconnect structure packages impact the overall cost of semiconductor device production?

The abstract does not provide specific details on the cost implications of pre-manufacturing interconnect structure packages.

What are the potential challenges or limitations of using pre-manufactured interconnect structure packages in semiconductor device packaging?

The abstract does not address any potential drawbacks or challenges that may arise from this manufacturing approach.

Original Abstract Submitted

Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.