18491551. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Young Lyong Kim of Anyang-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18491551 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The semiconductor package described in the patent application includes a first die with electrodes penetrating it, a first pad on the top surface of the first die, and a second die on top of the first die. There is also a second pad on the bottom surface of the second die, and a first connection terminal that connects the first pad to the second pad. An insulating layer fills the space between the first and second dies and encloses the first connection terminal. The first connection terminal is made of an intermetallic compound consisting of solder material and metallic material from the first and second pads. The concentration of the metallic material in the first connection terminal remains constant regardless of the distance from the first or second pad.

  • The semiconductor package includes a first and second die, connected by a first connection terminal made of an intermetallic compound.
  • The first connection terminal is made of solder material and metallic material from the first and second pads.
  • The concentration of the metallic material in the first connection terminal remains constant regardless of the distance from the first or second pad.
  • The package is filled with an insulating layer that encloses the first connection terminal.

Potential applications of this technology:

  • Semiconductor packaging for integrated circuits and electronic devices.
  • High-speed data processing and communication systems.
  • Consumer electronics, such as smartphones, tablets, and laptops.
  • Automotive electronics for advanced driver assistance systems and infotainment.

Problems solved by this technology:

  • Ensures a reliable and consistent connection between the first and second pads.
  • Reduces the risk of electrical failures or signal degradation due to variations in the concentration of metallic material.
  • Provides improved thermal and electrical conductivity between the first and second dies.

Benefits of this technology:

  • Enhanced reliability and performance of semiconductor packages.
  • Improved signal integrity and reduced risk of electrical failures.
  • Increased thermal and electrical conductivity for better heat dissipation and power efficiency.
  • Cost-effective manufacturing process for semiconductor packages.


Original Abstract Submitted

A semiconductor package including a first die, through electrodes penetrating the first die, a first pad on a top surface of the first die and coupled to a through electrode, a second die on the first die, a second pad on a bottom surface of the second die, a first connection terminal connecting the first pad to the second pad, and an insulating layer that fills a region between the first die and the second die and encloses the first connection terminal. The first connection terminal includes an intermetallic compound made of solder material and metallic material of the first and second pads. A concentration of the metallic material in the first connection terminal is substantially constant regardless of a distance from the first pad or the second pad.

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