20240087983.SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Daewoong Heo of Suwon-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240087983 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a method of manufacturing a semiconductor package with multiple layers of redistribution wiring, a semiconductor device mounted on the wiring layer, a sealing member covering the device, conductive connectors on the peripheral region, and heat transfer plugs formed in the through openings on the chip mounting region.

• Method of manufacturing a semiconductor package:

   - Form a first redistribution wiring layer with multiple layers of redistribution wires.
   - Mount a semiconductor device on the chip mounting region of the wiring layer.
   - Cover the device with a sealing member.
   - Form conductive connectors on the peripheral region, electrically connected to the redistribution wires.
   - Form heat transfer plugs in the through openings on the chip mounting region.

Potential Applications

The technology described in this patent application could be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics.

Problems Solved

This technology solves the problem of efficiently dissipating heat generated by semiconductor devices, ensuring optimal performance and reliability of electronic devices.

Benefits

- Improved heat dissipation capabilities. - Enhanced performance and reliability of electronic devices. - Compact design for semiconductor packages.

Potential Commercial Applications

Optimized Heat Dissipation Technology for Semiconductor Packages

Possible Prior Art

Prior art related to semiconductor packaging technologies with heat dissipation features, such as heat sinks, thermal pads, or other cooling solutions.

How does this technology compare to existing heat dissipation solutions in semiconductor packaging?

This technology offers a more integrated and efficient approach to heat dissipation compared to traditional methods like heat sinks or thermal pads. By incorporating heat transfer plugs directly into the package, it provides a more direct and effective cooling solution.

What impact could this technology have on the overall performance and lifespan of electronic devices?

This technology could significantly improve the performance and lifespan of electronic devices by ensuring that semiconductor devices operate at optimal temperatures, reducing the risk of overheating and potential damage.

Original Abstract Submitted

there is provided a method of manufacturing a semiconductor package, a first redistribution wiring layer including a chip mounting region and a peripheral region surrounding the chip mounting region is formed, and the first redistribution wiring layer has first redistribution wires stacked in at least two layers. a first semiconductor device is mounted on the chip mounting region on the first redistribution wiring layer. a sealing member is formed on the first redistribution wiring layer to cover the first semiconductor device. a plurality of conductive connectors is formed on the peripheral region, and the conductive connectors penetrate the sealing member and are electrically connected to the first redistribution wires. a plurality of through openings extending from an upper surface of the sealing member is formed on the chip mounting region and exposes an upper surface of the first semiconductor device. the through openings are filled up with a conductive material to form a plurality of heat transfer plugs.