18367285. INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES simplified abstract (Intel Corporation)
Contents
- 1 INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Abstract
- 1.6 Patent/Innovation Explanation
- 1.7 Potential Applications
- 1.8 Problems Solved
- 1.9 Benefits
- 1.10 Original Abstract Submitted
INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
Organization Name
Inventor(s)
Srinivas V. Pietambaram of Chandler AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Rahul N. Manepalli of Chandler AZ (US)
Debendra Mallik of Chandler AZ (US)
Robert L. Sankman of Phoenix AZ (US)
INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367285 titled 'INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES
Simplified Explanation
Abstract
A glass substrate is used to house a multi-die interconnect bridge in a semiconductor device package. Through-glass vias are used to connect the bridge to a surface for mounting on a semiconductor package substrate.
Patent/Innovation Explanation
- Glass substrate is used as a housing for a multi-die interconnect bridge in a semiconductor device package.
- Through-glass vias are used to establish communication between the bridge and a surface for mounting on a semiconductor package substrate.
Potential Applications
This technology has potential applications in the semiconductor industry, specifically in the development of semiconductor device packages. It can be used in various electronic devices, such as smartphones, computers, and other consumer electronics.
Problems Solved
- Provides a solution for housing a multi-die interconnect bridge in a semiconductor device package.
- Enables communication between the bridge and a surface for mounting on a semiconductor package substrate.
Benefits
- Utilizing a glass substrate as a housing can provide improved durability and thermal stability for the semiconductor device package.
- Through-glass vias enable efficient communication between the bridge and the semiconductor package substrate, enhancing overall performance and functionality.
Original Abstract Submitted
A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package. Through-glass vias communicate to a surface for mounting on a semiconductor package substrate.
