18380928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380928 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor chip with a chip pad, support pad, support bump, wiring substrate, support bonding on trace (BOT) pad, and a dummy area. The support bump is connected to the support pad, and the support BOT pad is bonded to the support bump on the wiring substrate.
- Semiconductor chip with chip pad and support pad:
- The semiconductor chip has a chip pad and a support pad positioned on the first surface of the semiconductor substrate.
- Support bump and wiring substrate:
- The support bump is connected to the support pad, and the wiring substrate is disposed to face the semiconductor substrate.
- Support BOT pad and dummy area:
- The support BOT pad is disposed on the wiring substrate and bonded to the support bump, while the dummy area is spaced apart from the support BOT pad.
Potential Applications
The technology described in this patent application could be applied in various semiconductor packaging applications, such as in microprocessors, memory chips, and other electronic devices requiring compact and efficient packaging solutions.
Problems Solved
This technology solves the problem of providing a reliable and efficient method for connecting semiconductor chips to wiring substrates while ensuring proper insulation and support for the components.
Benefits
The benefits of this technology include improved reliability, enhanced performance, and increased durability of semiconductor packages. Additionally, the design allows for more efficient use of space and resources in electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing, and consumer electronics markets. Companies involved in the production of semiconductor chips and electronic devices could benefit from implementing this innovative packaging solution.
Possible Prior Art
One possible prior art for this technology could be the use of support pads and bumps in semiconductor packaging to provide structural support and electrical connections between components. Additionally, the concept of using dummy areas in wiring substrates to optimize space and layout efficiency may have been explored in previous semiconductor packaging designs.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness and performance?
This article does not provide a direct comparison between this technology and existing semiconductor packaging solutions in terms of cost-effectiveness and performance. Further research and analysis would be needed to determine the specific advantages and disadvantages of this innovation compared to other methods.
What are the potential challenges or limitations of implementing this technology in mass production of semiconductor devices?
The article does not address the potential challenges or limitations of implementing this technology in mass production of semiconductor devices. Factors such as scalability, compatibility with existing manufacturing processes, and regulatory requirements could pose challenges that need to be considered in real-world applications.
Original Abstract Submitted
A semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (BOT) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support BOT pad.
