18346950. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18346950 titled 'SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM
Simplified Explanation
The abstract describes an electronic system that includes two interposers and two semiconductor chip structures. The first interposer has first signal paths, while the second interposer has second signal paths. The first semiconductor chip structure is located on both interposers and has a first circuit region and a second circuit region. The second semiconductor chip structure is also located on both interposers but is spaced apart from the first semiconductor chip structure. It includes a third circuit region that communicates with the first circuit region of the first semiconductor chip structure at a first rate through the first signal paths of the first interposer. It also includes a fourth circuit region that communicates with the second circuit region of the first semiconductor chip structure at a second rate, which is different from the first rate, through the second signal paths of the second interposer.
- The electronic system includes two interposers and two semiconductor chip structures.
- The interposers have different signal paths.
- The first semiconductor chip structure has a first circuit region and a second circuit region.
- The second semiconductor chip structure communicates with the first circuit region of the first semiconductor chip structure at a first rate through the first signal paths.
- The second semiconductor chip structure communicates with the second circuit region of the first semiconductor chip structure at a second rate through the second signal paths.
Potential applications of this technology:
- High-speed communication systems
- Data processing systems
- Integrated circuit design
Problems solved by this technology:
- Efficient communication between different circuit regions
- Minimizing signal interference
- Increasing data transfer rates
Benefits of this technology:
- Improved performance and efficiency of electronic systems
- Enhanced data processing capabilities
- Higher data transfer rates
Original Abstract Submitted
An electronic system includes a first interposer including first signal paths, a second interposer spaced apart from the first interposer and including second signal paths, a first semiconductor chip structure on the first and second interposers and including a first circuit region and a second circuit region, and a second semiconductor chip structure on the first and second interposers and spaced apart from the first semiconductor chip structure. The second semiconductor chip structure includes a third circuit region configured to communicate with the first circuit region of the first semiconductor chip structure at a first rate through the first signal paths of the first interposer and a fourth circuit region configured to communicate with the second circuit region of the first semiconductor chip structure at a second rate, different from the first rate, through the second signal paths of the second interposer.
