18226866. QUANTUM DEVICE simplified abstract (NEC Corporation)
Contents
QUANTUM DEVICE
Organization Name
Inventor(s)
QUANTUM DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226866 titled 'QUANTUM DEVICE
Simplified Explanation
The abstract describes a quantum device designed to effectively cool a quantum chip and the surrounding area. The device includes an interposer with a superconducting material layer and a non-superconducting material layer.
- The quantum device is capable of cooling a quantum chip and the area around it.
- The device includes an interposer with a superconducting material layer and a non-superconducting material layer.
Potential Applications
The technology could be applied in:
- Quantum computing
- High-performance computing
- Superconducting electronics
Problems Solved
The technology addresses the issue of cooling quantum chips effectively, which is crucial for their optimal performance.
Benefits
The benefits of this technology include:
- Improved efficiency of quantum chips
- Enhanced reliability of quantum computing systems
- Better overall performance of high-performance computing systems
Potential Commercial Applications
- Quantum computing industry
- High-performance computing companies
- Electronics manufacturers
Possible Prior Art
There may be prior art related to superconducting cooling systems for electronic devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does the device compare to traditional cooling methods for quantum chips?
The article does not provide a direct comparison between the new quantum cooling device and traditional cooling methods. This information would be valuable for understanding the advantages of the proposed technology.
What are the specific materials used in the superconducting and non-superconducting layers of the interposer wiring?
The abstract mentions the presence of superconducting and non-superconducting material layers in the interposer wiring, but does not specify the exact materials used. Knowing the specific materials could provide insights into the performance and capabilities of the quantum cooling device.
Original Abstract Submitted
A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.
