18374996. EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
Contents
- 1 EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Organization Name
Inventor(s)
Ya Ling Huang of Taichung (TW)
Jong Sik Paek of Taichung (TW)
Lihao Lyu of Hsinchu City (TW)
Syuan-Ye Chen of Taichung (TW)
EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374996 titled 'EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Simplified Explanation
The present technology involves a semiconductor device assembly with a mold material encasing the semiconductor device and directly coupled to the top surface and side surface of the RDL.
- The semiconductor device assembly includes an RDL with a top surface and a side surface intersecting the top surface.
- A semiconductor device is coupled to the top surface of the RDL.
- A mold material encases the semiconductor device and is directly coupled to at least a portion of the top surface and side surface of the RDL.
Potential Applications
This technology could be used in:
- Consumer electronics
- Automotive industry
- Aerospace applications
Problems Solved
This technology helps in:
- Improving the durability of semiconductor devices
- Enhancing the reliability of electronic components
- Providing better protection against external elements
Benefits
The benefits of this technology include:
- Increased longevity of semiconductor devices
- Improved performance of electronic systems
- Enhanced resistance to environmental factors
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Manufacturing of smartphones and tablets
- Automotive electronics industry
- Aerospace technology development
Possible Prior Art
One possible prior art for this technology could be the use of mold materials in semiconductor packaging to improve device reliability and performance.
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods?
This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods. It would be interesting to know the specific advantages and disadvantages of this new approach in comparison to existing methods.
What are the specific materials used in the mold material for encasing the semiconductor device?
The article does not mention the specific materials used in the mold material. Understanding the composition of the mold material could provide insights into the performance and characteristics of the semiconductor device assembly.
Original Abstract Submitted
The present technology can include a semiconductor device assembly comprising an RDL with a top surface and a side surface intersecting the top surface. The assembly can further comprise a semiconductor device coupled to the top surfaces, and a mold material encasing the semiconductor device (when included) and directly coupled to at least a portion of the top surface and the side surface of the RDL. In other embodiments, the assembly can comprise an RDL with a top surface, a bottom surface opposite thereto, and a sloped side surface extending between the top surface and the bottom surface. The assembly similarly can further comprise a semiconductor device coupled to the top surface, and a mold material encasing the semiconductor device and directly coupled to at least a portion of the top surface and the side surface of the RDL.
