18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Feng-Cheng Hsu of New Taipei City (TW)

Shuo-Mao Chen of New Taipei City (TW)

Shin-Puu Jeng of Hsinchu (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18510646 titled 'PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a package structure for electronic components.

• The package structure includes a die, a through via, an encapsulant, a warpage controlling layer, and a cap.
• The through via is located laterally aside the die.
• The encapsulant laterally encapsulates the through via and the die.
• The warpage controlling layer covers the encapsulant and the die.
• The cap is laterally aside the warpage controlling layer and on the through via.
• The cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the warpage controlling layer.

Potential Applications

• Electronic packaging for integrated circuits
• Microelectronics assembly

Problems Solved

• Warpage issues in electronic packaging
• Ensuring proper encapsulation of components

Benefits

• Improved reliability of electronic components
• Enhanced protection against environmental factors
• Better control of warpage in electronic packages

Original Abstract Submitted

Provided is a package structure including a die, a through via, an encapsulant, a warpage controlling layer, and a cap. The through via is laterally aside the die. The encapsulant laterally encapsulates the through via and the die. The warpage controlling layer covers the encapsulant and the die. The cap is laterally aside the warpage controlling layer and on the through via. The cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the warpage controlling layer.