18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Yuseon Heo of Suwon-si (KR)

Junhyeong Park of Suwon-si (KR)

Jieun Park of Suwon-si (KR)

Jihye Shim of Suwon-si (KR)

Jiyoung Lee of Suwon-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18381905 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The method described in the abstract involves manufacturing a semiconductor package by forming wiring structures, coating with high transmittance photoresist, creating openings, filling with conductive material, placing a semiconductor chip, encapsulating, and forming additional wiring structures.

• Formation of first wiring structure
• Coating with high transmittance photoresist multiple times
• Creating openings through exposure and development
• Filling openings with conductive material to create conductive posts
• Removing high transmittance photoresist
• Placing semiconductor chip and encapsulating
• Forming second wiring structure on encapsulant

1. 1. 1. Potential Applications

- Semiconductor packaging industry - Electronics manufacturing

1. 1. 1. Problems Solved

- Improved light transmittance in semiconductor packages - Enhanced performance and reliability of electronic devices

1. 1. 1. Benefits

- Higher quality semiconductor packages - Increased efficiency in electronic devices

1. 1. 1. Potential Commercial Applications
         1. Enhanced Semiconductor Packaging Technology

- Optimizing light transmittance in semiconductor packages for improved performance

1. 1. 1. Possible Prior Art

There may be prior art related to methods of enhancing light transmittance in semiconductor packages, but specific examples are not provided in this context.

1. 1. 1. 1. Unanswered Questions
         2. How does the high transmittance photoresist contribute to the overall performance of the semiconductor package?

The high transmittance photoresist allows for better light transmittance within the package, which can improve the functionality of optical components within the semiconductor device.

1. 1. 1. 1. What are the specific materials used for the conductive posts in this manufacturing method?

The abstract does not specify the exact conductive material used to fill the openings and create the conductive posts within the semiconductor package.

Original Abstract Submitted

Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, coating a high transmittance photoresist on the first wiring structure a plurality of number of times, forming a plurality of openings by exposing and developing the high transmittance photoresist, forming a plurality of conductive posts by filling the plurality of openings with a conductive material, removing the high transmittance photoresist, disposing a semiconductor chip on the first wiring structure, forming an encapsulant surrounding the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the light transmittance of the high transmittance photoresist at a portion where the first wiring structure and the high transmittance photoresist contact each other is greater than or equal to 3.2%.