18340193. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18340193 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a front redistribution structure with multiple redistribution layers, connection bumps, and an underfill material within a recess.
- The front redistribution structure consists of an insulating layer with front redistribution layers on different levels, including an inner and outer redistribution layer.
- Connection bumps are present within the recess, with one bump connected to the first redistribution layer and another bump connected to the outer redistribution layer.
- The underfill material extends along the side surfaces of the connection bumps and a dam within the recess.
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor packages for electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This innovation helps improve the electrical connectivity and reliability of semiconductor packages by providing a more robust structure with connection bumps and underfill material.
Benefits
The semiconductor package offers enhanced performance, durability, and longevity compared to traditional packaging methods. It also allows for more efficient heat dissipation and overall better functionality of electronic devices.
Potential Commercial Applications
The technology could be utilized in the production of high-performance electronic devices, automotive electronics, aerospace applications, and other industries requiring reliable semiconductor packaging solutions.
Possible Prior Art
One possible prior art could be the use of underfill materials in semiconductor packaging to enhance mechanical strength and reliability. Another could be the implementation of connection bumps for improved electrical connections within semiconductor packages.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
The cost-effectiveness of this technology compared to traditional packaging methods is not addressed in the abstract. Further research or analysis would be needed to determine the economic viability of implementing this innovation.
What impact does the underfill material have on the overall performance and reliability of the semiconductor package?
While the presence of the underfill material is mentioned in the abstract, the specific effects on performance and reliability are not detailed. Additional testing or studies would be required to assess the full impact of the underfill material on the semiconductor package.
Original Abstract Submitted
A semiconductor package including: a front redistribution structure including an insulating layer defining an upper surface, a lower surface opposing the upper surface, and a side surface, front redistribution layers including a first redistribution layer on a first level adjacent to the lower surface and second redistribution layers on a second level higher than the first level relative to the lower surface, the second redistribution layers having an inner redistribution layer and an outer redistribution layer, a recess exposing at least a portion of the outer redistribution layer, and a dam on at least one side of the recess; connection bumps including a first bump electrically connected to the first redistribution layer and a second bump electrically connected to the outer redistribution layer within the recess; and an underfill that extends along a side surface of the second bump and a side surface of the dam within the recess.
