Intel corporation (20240105572). GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION simplified abstract
Contents
- 1 GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Organization Name
Inventor(s)
Zhiguo Qian of Chandler AZ (US)
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105572 titled 'GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Simplified Explanation
The present disclosure relates to techniques for ground via clustering for crosstalk mitigation in integrated circuit assemblies.
- Ground via clustering for crosstalk mitigation in IC assemblies:
- IC package assembly includes first package substrate for routing signals and ground - Plurality of contacts on one side of the first package substrate - At least two ground vias of the same layer forming a cluster electrically coupled with an individual contact
Potential Applications
The technology can be applied in various integrated circuit assemblies where crosstalk mitigation is crucial, such as high-speed data processing systems, communication devices, and automotive electronics.
Problems Solved
1. Crosstalk interference in integrated circuit assemblies 2. Ensuring signal integrity and reliability in high-speed data transmission
Benefits
1. Improved signal quality and reduced crosstalk interference 2. Enhanced performance and reliability of integrated circuit assemblies 3. Cost-effective solution for crosstalk mitigation in IC packages
Potential Commercial Applications
Optimizing signal integrity in high-speed data processing systems
Possible Prior Art
Prior art may include techniques for crosstalk mitigation in integrated circuit assemblies using different grounding configurations.
Unanswered Questions
How does ground via clustering compare to other crosstalk mitigation techniques in terms of effectiveness and cost-efficiency?
Ground via clustering offers a cost-effective solution for crosstalk mitigation, but further research may be needed to compare its effectiveness with other techniques.
What are the potential challenges in implementing ground via clustering in different types of integrated circuit assemblies?
The implementation of ground via clustering may vary based on the design and layout of different IC assemblies, leading to potential challenges in ensuring optimal crosstalk mitigation.
Original Abstract Submitted
embodiments of the present disclosure are directed towards techniques and configurations for ground via clustering for crosstalk mitigation in integrated circuit (ic) assemblies. in some embodiments, an ic package assembly may include a first package substrate configured to route input/output (i/o) signals and ground between a die and a second package substrate. the first package substrate may include a plurality of contacts disposed on one side of the first package substrate and at least two ground vias of a same layer of vias, and the at least two ground vias may form a cluster of ground vias electrically coupled with an individual contact. other embodiments may be described and/or claimed.
