18318827. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngjun Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18318827 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a film substrate with wires, an insulating film, pad openings, a mounting region opening, a semiconductor chip, and support patterns.
- Film substrate with wires and insulating film: The package has a film substrate with a plurality of wires on its upper surface, covered by an upper insulating film that defines pad openings and a mounting region opening.
- Semiconductor chip bonding: The semiconductor chip is bonded to and electrically connected to the exposed inner lead bonding portion of the wires.
- Support patterns: There is at least one support pattern on the lower surface of the film substrate that overlaps with the pad openings.
Potential Applications
- Semiconductor packaging
- Electronics manufacturing
- Integrated circuit assembly
Problems Solved
- Improved electrical connections
- Enhanced structural support
- Efficient semiconductor chip bonding
Benefits
- Higher reliability
- Increased performance
- Cost-effective manufacturing process
Original Abstract Submitted
A semiconductor package includes a film substrate; a plurality of wires on an upper surface of the film substrate; an upper insulating film covering the plurality of wires on the upper surface of the film substrate and defining a plurality of pad openings and a mounting region opening such that, the plurality of pad openings expose at least a portion of an outer lead bonding portion of the plurality of wires along at least one of the first side surface or the second side surface and the mounting region opening exposes at least a portion of an inner lead bonding portion of the plurality of wiring; a semiconductor chip bonded to and electrically connected to the exposed inner lead bonding portion, and at least one support pattern on a lower surface of the film substrate and extending in the first direction to overlap with the plurality of pad openings.
