18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sangho Lee of Suwon-si (KR)

Kihyun Kim of Suwon-si (KR)

Sangyong Park of Suwon-si (KR)

Kwanghyun Baek of Suwon-si (KR)

Seungjae Baek of Suwon-si (KR)

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18467062 titled 'PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE

Simplified Explanation

The patent application describes a package device that includes a substrate with upper and lower lands on its surfaces. The upper lands have solder balls and are connected to a die, while the lower lands have some solder balls and a capacitor connected to the remaining lands. The capacitor is positioned on the opposite side of the die and has a greater height than the lower solder balls.

  • The package device includes a substrate, upper and lower lands, solder balls, a die, and a capacitor.
  • The upper lands are located on one surface of the substrate and are connected to the die.
  • The upper solder balls are disposed on the upper lands.
  • The lower lands are located on the other surface of the substrate.
  • Some of the lower lands have lower solder balls, while the remaining lands have a capacitor connected to them.
  • The capacitor is positioned on the opposite side of the die and has a greater height than the lower solder balls.

Potential Applications:

  • This package device can be used in electronic devices such as smartphones, tablets, and laptops.
  • It can be applied in various industries including telecommunications, consumer electronics, and automotive.

Problems Solved:

  • The package device provides a compact and efficient solution for connecting a die and a capacitor in a single package.
  • It eliminates the need for separate components and reduces the overall size and complexity of the device.
  • The arrangement of the lands, solder balls, and capacitor allows for improved electrical connections and signal transmission.

Benefits:

  • The package device offers improved space utilization and miniaturization of electronic devices.
  • It simplifies the manufacturing process by integrating multiple components into a single package.
  • The design enhances the performance and reliability of the device by optimizing electrical connections and reducing signal interference.


Original Abstract Submitted

A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.

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