18518456. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hao-Jan Pei of Hsinchu (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Wei-Yu Chen of Taipei City (TW)

Chia-Shen Cheng of Hsinchu County (TW)

Chih-Chiang Tsao of Taoyuan City (TW)

Jen-Jui Yu of Taipei City (TW)

Cheng-Shiuan Wong of Hsinchu (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18518456 titled 'PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a package structure that includes a die, an encapsulant laterally encapsulating the die, a warpage control material over the die, and a protection material over the encapsulant and around the warpage control material. The protection material has a lower coefficient of thermal expansion than the encapsulant.

• Die encapsulated with an encapsulant
• Warpage control material placed over the die
• Protection material surrounding the encapsulant and warpage control material
• Protection material has lower coefficient of thermal expansion than encapsulant

Potential Applications

The technology described in the patent application could be applied in the semiconductor industry for packaging electronic components to prevent warpage and ensure stability.

Problems Solved

This technology addresses the issue of warpage in electronic components, which can lead to performance issues and reliability concerns in electronic devices.

Benefits

- Improved stability and reliability of electronic components - Prevention of warpage in packaged components - Enhanced performance of electronic devices

Original Abstract Submitted

A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.