18450836. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Hyungjun Park of Suwon-si (KR)
Seonghoon Bae of Suwon-si (KR)
Kwangok Jeong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18450836 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the abstract includes a redistribution structure with multiple redistribution conductive patterns, conductive vias, lower pads, and insulation layers. A semiconductor chip is placed on the redistribution structure, and external connection terminals are attached to the lower surface pads.
- The semiconductor package features redistribution conductive patterns with a metal layer containing copper and a skin layer with copper and nickel.
- The redistribution structure allows for efficient connection and communication within the semiconductor package.
- The inclusion of insulation layers helps to prevent interference and damage to the components.
- The external connection terminals enable the semiconductor package to interface with external devices.
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- Potential Applications
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can also be applied in automotive electronics, medical devices, and industrial equipment.
- Problems Solved
- Provides a reliable and efficient method for redistributing signals within a semiconductor package.
- Helps to improve the overall performance and reliability of electronic devices.
- Reduces the risk of signal interference and damage to the components.
- Benefits
- Enhanced connectivity and communication within the semiconductor package.
- Improved durability and longevity of electronic devices.
- Enables smaller and more compact designs for electronic products.
Original Abstract Submitted
Provided is a semiconductor package. The semiconductor package including a redistribution structure including a plurality of redistribution conductive patterns, a plurality of conductive vias connected to at least one of the plurality of redistribution conductive patterns, a plurality of lower pads connected to the plurality of conductive vias, and a plurality of redistribution insulation layers and the plurality of redistribution conductive patterns alternating each other, a semiconductor chip arranged on the redistribution structure, and an external connection terminal attached to the plurality of lower surface pads of the redistribution structure, wherein each of the plurality of redistribution conductive patterns includes a metal layer including copper and a skin layer arranged on an upper surface of the metal layer and including copper and nickel, may be provided.
