18366098. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18366098 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate and a silicon-free interposer. The silicon-free interposer consists of a second core layer, first interposer through electrodes connected to the first core, and second interposer through electrodes connected to the second core. The diameters of the through electrodes may vary between the first core and second core, as well as between the first interposer and second interposer.
- Package includes package substrate and silicon-free interposer
- Silicon-free interposer has second core layer
- First interposer through electrodes connected to first core
- Second interposer through electrodes connected to second core
- Diameters of through electrodes may differ between cores and interposers
- Potential Applications
- Semiconductor packaging - Electronic devices - Integrated circuits
- Problems Solved
- Reducing silicon content in interposer - Improving connectivity in semiconductor packages
- Benefits
- Enhanced performance - Cost-effective manufacturing - Increased reliability
Original Abstract Submitted
A semiconductor package may include a package substrate and a silicon-free interposer. The silicon-free interposer may include a second core layer, first interposer through electrodes passing through the second core layer and connected to the first core through electrodes, and second interposer through electrodes passing through the second core layer and connected to the second core through electrodes. Diameters of the first core through electrodes may be different from diameters of the second core through electrodes, and diameters of the first interposer through electrodes may be different from diameters of the second interposer through electrodes.
