18370914. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Masazumi Amagai of Suwon-si (KR)
Tae Sung Jeong of Suwon-si (KR)
FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18370914 titled 'FAN-OUT SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract of this patent application describes a fan-out semiconductor package that improves reliability by reducing stress on the connection pads of a semiconductor chip. This is achieved by redistributing and electrically connecting the connection pads to connection terminals using an interconnection member. The design of the vias and pads in the interconnection member is specifically tailored to minimize stress.
- The fan-out semiconductor package includes connection pads of a semiconductor chip.
- The connection pads are redistributed and electrically connected to connection terminals.
- An interconnection member is used to facilitate the redistribution and electrical connection.
- The disposition forms of vias and pads in the interconnection member are designed to reduce stress.
- The reduction in stress improves the reliability of the fan-out semiconductor package.
Potential Applications:
- Semiconductor packaging industry
- Electronics manufacturing industry
- Integrated circuit design and production
Problems Solved:
- Reducing stress on connection pads of a semiconductor chip
- Improving reliability of semiconductor packages
Benefits:
- Enhanced reliability of fan-out semiconductor packages
- Improved performance of semiconductor chips
- Increased lifespan of electronic devices using these packages
Original Abstract Submitted
A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
