Hyundai motor company (20240120269). POWER MODULE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 POWER MODULE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
POWER MODULE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Kyoung Kook Hong of Hwaseong-Si (KR)
Su Bin Kang of Seomgnam-Si (KR)
Young Seok Kim of Seongnam-Si (KR)
POWER MODULE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120269 titled 'POWER MODULE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a power module and a manufacturing method that includes semiconductor chips, an insulating circuit board with an insulating layer and a first metal layer, and lead frames positioned between the semiconductor chips and the insulating circuit board.
- Semiconductor chips are a key component of the power module.
- The insulating circuit board features an insulating layer and a first metal layer.
- Lead frames are used to connect the semiconductor chips to the insulating circuit board.
Potential Applications
The technology described in the patent application could be applied in various power electronics systems, such as inverters, converters, and motor drives.
Problems Solved
This technology helps to improve the efficiency and reliability of power modules by providing a secure and efficient connection between semiconductor chips and the insulating circuit board.
Benefits
The use of lead frames and the specific design of the insulating circuit board can enhance the performance and longevity of power modules, leading to more reliable electronic systems.
Potential Commercial Applications
The technology could be utilized in industries such as automotive, renewable energy, industrial automation, and consumer electronics for the development of advanced power modules.
Possible Prior Art
One possible prior art could be the use of lead frames in electronic packaging to provide electrical connections between semiconductor devices and circuit boards.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and reliability?
This article does not provide a direct comparison with existing power module designs, so it is unclear how this technology stacks up against current solutions.
What are the potential cost implications of implementing this technology in mass production?
The article does not address the potential cost implications of mass-producing power modules using this technology, leaving a gap in understanding the economic feasibility of the innovation.
Original Abstract Submitted
a power module and a manufacturing method include semiconductor chips, an insulating circuit board including an insulating layer and a first metal layer disposed on a first surface of the insulating layer, and lead frames disposed between the semiconductor chips and the insulating circuit board.
