18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
Contents
- 1 INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
Organization Name
Inventor(s)
Xiaoning Ye of Portland OR (US)
Yunhui Chu of Hillsboro OR (US)
James A. Mccall of Portland OR (US)
INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18260810 titled 'INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS
Simplified Explanation
The abstract describes an integrated circuit (IC) support with microstrips and conductive segments included in a tape.
- The IC support includes multiple microstrips and conductive segments.
- Each conductive segment overlaps at least two microstrips.
- A dielectric material separates the microstrips from the conductive segments.
- The conductive segments are part of a tape structure.
Potential Applications
This technology could be applied in:
- High-frequency electronic circuits
- Signal transmission systems
- Microwave devices
Problems Solved
This technology helps in:
- Improving signal integrity
- Reducing electromagnetic interference
- Enhancing overall circuit performance
Benefits
The benefits of this technology include:
- Enhanced signal transmission efficiency
- Improved reliability of electronic devices
- Simplified manufacturing processes
Potential Commercial Applications
Optimizing IC supports with microstrips for improved performance
Unanswered Questions
How does this technology impact the cost of manufacturing electronic devices?
This technology could potentially increase the initial cost of manufacturing due to the use of specialized materials and processes. However, the long-term benefits of improved performance and reliability may outweigh the initial investment.
What are the environmental implications of using this technology?
The use of dielectric materials and conductive segments in IC supports may raise concerns about the environmental impact of electronic waste. Proper disposal and recycling methods would need to be considered to mitigate any potential environmental harm.
Original Abstract Submitted
Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and the conductive segments are included in a tape.
