18520467. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tsung-Shu Lin of New Taipei City (TW)
Hsuan-Ning Shih of Taoyuan City (TW)
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520467 titled 'PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a package structure that includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, with the conductive pads connected to the redistribution circuit structure. The first contact pad has a smaller width than the conductive pads, while the second contact pad has a width equal to or greater than the conductive pads.
- Semiconductor die with redistribution circuit structure and conductive pads
- Redistribution circuit structure with first and second contact pads
- Conductive pads connected to the redistribution circuit structure
- First contact pad narrower than conductive pads, second contact pad equal to or wider than conductive pads
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor dies to external components through redistribution circuit structures and conductive pads of varying widths.
Benefits
The benefits of this technology include improved electrical connectivity, space efficiency, and potentially enhanced performance of electronic devices.
Potential Commercial Applications
- "Innovative Package Structure for Enhanced Electronic Devices"
Possible Prior Art
One possible prior art could be the use of redistribution circuit structures in semiconductor packaging to improve connectivity and performance.
Unanswered Questions
How does this technology compare to existing packaging structures in terms of performance and cost?
The article does not provide a direct comparison with existing packaging structures in terms of performance and cost.
What specific electronic devices or industries could benefit the most from this technology?
The article does not specify which electronic devices or industries could benefit the most from this technology.
Original Abstract Submitted
A package structure includes a semiconductor die, a redistribution circuit structure, and conductive pads. The redistribution circuit structure is located on and electrically connected to the semiconductor die, the redistribution circuit structure includes a first contact pad having a first width and a second contact pad having a second width. The conductive pads are located on and electrically connected to the redistribution circuit structure through connecting to the first contact pad and the second contact pad, the redistribution circuit structure is located between the conductive pads and the semiconductor die. The first width of the first contact pad is less than a width of the conductive pads, and the second width of the second contact pad is substantially equal to or greater than the width of the conductive pads.
